Qualcomm kicked off its annual summits on Tuesday. Firstly the chipmaker reveals their two new upcoming chipsets on Qualcomm’s new Modular Platform. Snapdragon 865 is the heir to the Snapdragon 855.
On the other hand, Snapdragon 765/765G is a new chipset with integrated support for 5G.
The Modular Platform part of the announcement offers carriers the tools to let them more easily implement their own 5G technologies to the new chipsets.
The Snapdragon 865 and Snapdragon X55 Modem can pair with each other. It can recall the X50 Modem with a newer, more power-efficient process.
The X55 has higher like theoretical down/up speeds and supports SA/NSA networks. It also supports both mmWave and Sub-6 GHz. Which can improved bandwidth on Sub-6GHz on 5G Network?
Snapdragon 765(G) comes with an integrated 5G support. But further details about its modem published on our site.
3D Sonic Max is the other announcement of Qualcomm’s new in-display fingerprint technology. I know it’s sounding like an old Sega game. The new fingerprint sensor has a significantly larger workable area.
It also allows the user to authenticate with two fingers, such as using both thumbs. The accuracy of the scanner is improved.