MediaTek Developed First-Ever 3nm Chipset Using TSMC Technology. MediaTek and TSMC have made a ground-breaking statement about their productive partnership in creating MediaTek’s first-ever 3nm chip using TSMC’s state-of-the-art technology. This collaboration represents a critical turning point in the long-standing relationship between these two tech behemoths and has the promise of revolutionizing the semiconductor manufacturing industry.
The approaching year will see the start of mass production for MediaTek’s flagship Dimensity system-on-chip (SoC), a market leader in semiconductor solutions. This partnership demonstrates the businesses’ dedication to use their own capabilities in chip design and production to jointly develop flagship SoCs with greater performance and power efficiency, increasing the user experience across a variety of worldwide devices.
MediaTek’s president, Joe Chen, reaffirmed the company’s commitment to leveraging cutting-edge technology to produce goods that enhance our quality of life. Due to TSMC’s continuous dedication to high-quality production, MediaTek is able to demonstrate its excellent chip design and provide clients all over the globe with high-performance and reliable solutions, particularly in the cutthroat flagship market.
MediaTek Developed First-Ever 3nm Chipset Using TSMC Technology
Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC, stressed that this partnership broadens the use of cutting-edge semiconductor process technology by making it available to commonplace gadgets like cellphones.
Over the years, the collaboration between MediaTek and TSMC has produced a number of advancements, and they are eager to continue setting new standards into the 3nm generation and beyond. The key to this accomplishment is TSMC’s 3nm process technology, which offers considerable enhancements in performance, power efficiency, and yield over their prior N5 process.
The Dimensity SoCs created by MediaTek may increase speed by up to 18% while using the same amount of power or decrease power use by up to 32% while maintaining speed when using TSMC’s 3nm technology. A stunning 60% increase in logic density is also made possible by this technology, opening the door for stronger and more effective gadgets.