Apple to use TSMC’s upcoming 3nm node (N3E) for the next iPhone and Mac chipset. TSMC spun off the N5 and the N4 nodes (referred to as “4nm” and “5nm”) into their own family of chips, but later in 2018, they will introduce the next step up, their new N3 node.
This node won’t be as powerful or efficient as the superior N3E node slated for 2019/2020, but it can still be used for upcoming iPads. The next major upgrade will be given to Apple with the PPA-spec A17 chip that TSMC is expected to ship in 2020.
Apple to use TSMC’s upcoming 3nm node (N3E) for the next iPhone and Mac chipset.
Other than this, the current A16 chip will continue doing its job for now. These nodes still use FinFet designs like other FinFet-based nodes from TSMC (N4 and N3). Also, note that a part of TSMC’s effort is producing chip designs with Gate All Around architectures.
Intel originally signed a contract with TSMC this year or early next year to create its own 3nm chips at TSMC’s factories, but it appears that the order has been delayed until late in 2024.